DMI uses Automated X-ray Inspections for Ball Grid Array (BGA) designs to find faults inside or underneath the package. By using this state-of-the-art method of inspection, potential faults such as opens, shorts, insufficient solder, excessive solder, missing electrical parts, and misaligned components are exposed, helping us ensure that no defective products are delivered.
AXI also utilizes white paint on the outer edges of the board, allowing for easier sensor detection.
When components are populated close the edge of the PCB, AXI provides a conveyed edge for the machine to easily detect them. AXI also provides added stabilization support minimizing vibration in the board while it is being moved in the machine by the stage.