JFP (Joint Flying Probe)

In today’s electronics manufacturing market, the demand to produce smaller and faster electronics equipment with increasing functional capabilities is non-stop. Printed circuit boards (PCBs) are increasingly smaller and more densely populated, and 100% test-point access may not be practical, or even possible.

Joint Flying Probe (JFP) test systems have become increasingly popular tools for manufacturing verification, as well as some functional verification of PCBs.

DMI’s JFP armatures allow the test probes to make contact at more acute angles, allowing greater access to test points, component lands, or vias that may not be readily accessible using other conventional methods of probing.

Another advantage to JFP is that it provides added rigidity to the PCBs during the probing process. The probe pressure applied to the PCBs in conventional probing techniques can cause the board to flex, potentially resulting in damaged traces and broken solder joints. The JFP process minimizes the contact pressure made by the probes, helping keep the integrity of the board intact.

JFP utilizes white paint for sensor detection. When components are populated close the edge of the PCB, JFP provides a conveyed edge for the machine to easily detect them.